Transforming Discarded Molding Strips from Semiconductor Packaging Process into High-Grade Materials

Utilizing patented low-carbon green processing technology, Transcene recycles waste epoxy molding compound (EMC) scrapes from the IC packaging industry into high-quality, low-carbon spherical silicon dioxide products.

Mining gold from waste: High purity spherical silica

The semiconductor packaging process generates large amounts of waste EMC scrapes, which in the past could only be disposed of by incineration. Transcene discovered that these scrapes contain more than 90% high-purity spherical silica, which is a key semiconductor material of great importance that Taiwan has access to only through imports.

Turning decay into magic: green process reengineering and technological R&D upgrade

Transcene has developed a low-carbon green process patented technology and collaborated with academic and research units to enable more effective purification, powder engineering and surface treatment technologies for converting waste EMC scrapes into high-value spherical silicon dioxide products. Of the same quality as brand new materials, this silica can be used in the electronics industry, ceramics industry, rubber and plastics industry, coatings industry, and refractory materials industry, etc., at an even more competitive price.

Towards low carbon emissions: packaging material recycling verification

Transcene is actively working with customers to verify the recycling of packaging materials for the sustainable supply of semiconductor packaging, successfully completing the verification of a mold release agent and introducing it into the production line for use. Going forward, the company planes to gradually increase the penetration rate of recycled materials in the packaging process in line with customers’ net-zero goals.

Benefits

  • Reducing energy consumption by 50% compared to virgin spherical silica.
  • Mitigating carbon emissions during the incineration treatment stage of waste molding strips.
  • It is anticipated to tackle the 3,000 tons of molding strip waste produced annually by Taiwan’s semiconductor packaging industry, creating an annual industry benefit of NT$100 million.